Microsection: 32-layer PCB
Conductive pattern: innerlayers
| TECHNICAL DATA AND KEY FIGURES FOR BACKPLANES | ||
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| Final format |
up to 1,350 x 610 mm (larger on request) | |
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| Number of layers |
unlimited | |
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| Board thickness |
up to 10 mm | |
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| Material |
FR4 (standard) High-performance base materials incl. high-frequency applications |
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| Surface finishing |
Pb/Sn immersion tin immersion ni/au |
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| Copper thickness |
12 µm/17 µm/35 µm | |
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| Aspect ratio |
up to 1 : 17 | |
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| Conductive pattern |
120 µm | |
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| Impedance |
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> Order documentation
