Microsection 12-layer PCB


Microvia technology

 
TECHNICAL DATA AND KEY FIGURES FOR A SPECIAL HDI BOARD
Format
565 x 234 mm
Number of layers
36 layers (with 1+1 microvia layers)
Board thickness
6.4 mm
Drill diameter, conventional
Microvias – laser-drilled
0.60 mm
120 µm
Number of holes
10,628 + 4,034 microvias
Line width/Line distance
150 µm/130 µm
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