High layer count multilayers
Buried vias, blind vias
| TECHNICAL DATA AND KEY FIGURES FOR SYSTEM PCB'S | ||
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| Final format |
as desired, up to backplane format | |
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| Number of layers |
unlimited | |
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| Board thickness |
0.5 to 10 mm | |
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| Material |
FR4 (standard) High-performance base materials incl. high-frequency applications |
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| Surface finishing |
hot air levelling immersion nickel-gold immersion tin immersion silver bond gold hard gold plating Entek |
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| Laminate thickness |
from 0.05 mm | |
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| Conductive pattern |
> = 80 µm | |
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| Drill diameter, conventional technology |
0.25 mm | |
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| Drill diameter, microvia technology |
> 50 µm (laser technology) | |
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| Aspect ratio |
up to 1 : 14 | |
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| Multiple-pressed multilayers |
buried and/or blind vias | |
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| Special features |
buried resistors (BR) buried capacitances (BC) |
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> Order documentation
